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PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
Rev. 01 -- 30 March 2007 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOT346 (SC-59A/TO-236) small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I I I I Forward current: IF 1 A Reverse voltage: VR 20 V Very low forward voltage Small SMD plastic package
1.3 Applications
I I I I I Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection Low power consumption applications
1.4 Quick reference data
Table 1. Symbol IF VR VF
[1]
Quick reference data Parameter forward current reverse voltage forward voltage IF = 1 A
[1]
Conditions Tsp 55 C
Min -
Typ 400
Max 1 20 450
Unit A V mV
Pulse test: tp 300 s; 0.02.
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2. Pin 1 2 3 Pinning Description anode not connected cathode
1 2 3 1 3 2 n.c.
006aaa436
Simplified outline
Symbol
3. Ordering information
Table 3. Ordering information Package Name PMEG2010AEK SC-59A Description plastic surface-mounted package; 3 leads Version SOT346 Type number
4. Marking
Table 4. Marking codes Marking code H1 Type number PMEG2010AEK
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF IFRM IFSM Ptot Tj Tamb Tstg
[1] [2]
Parameter reverse voltage forward current repetitive peak forward current non-repetitive peak forward current total power dissipation junction temperature ambient temperature storage temperature
Conditions Tsp 55 C tp 1 ms; 0.25 square wave; tp = 8 ms Tamb 25 C
[1] [2]
Min -65 -65
Max 20 1 3 4.5 250 350 150 +150 +150
Unit V A A A mW mW C C C
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PMEG2010AEK_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 30 March 2007
2 of 9
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 500 360 150
Unit K/W K/W K/W
Rth(j-sp)
[1] [2] [3] [4]
thermal resistance from junction to solder point
[4]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab.
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 10 mA IF = 100 mA IF = 1 A IR reverse current VR = 5 V VR = 10 V VR = 20 V Cd
[1]
Conditions
[1]
Min -
Typ 200 265 400 15 20 50 55
Max 220 290 450 20 80 200 70
Unit mV mV mV A A A pF
diode capacitance
Pulse test: tp 300 s; 0.02.
VR = 5 V; f = 1 MHz
PMEG2010AEK_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 30 March 2007
3 of 9
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
104 IF (mA) 103
006aab032
IR (A)
105 104 103
(1) (2)
006aab033
102
(1)
(2)
(3)
(4)
(5)
102 10
(3)
10
1 10-1
1 10-2 10-1 0 0.2 0.4 VF (V) 0.6 10-3 0
(4)
5
10
15 VR (V)
20
(1) Tamb = 150 C (2) Tamb = 125 C (3) Tamb = 85 C (4) Tamb = 25 C (5) Tamb = -40 C
(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C
Fig 1. Forward current as a function of forward voltage; typical values
Fig 2. Reverse current as a function of reverse voltage; typical values
mdb824
200 Cd (pF) 150
100
50
0
0
5
10
15
VR (V)
20
f = 1 MHz; Tamb = 25 C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
PMEG2010AEK_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 30 March 2007
4 of 9
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
8. Test information
t1 t2
P t2 t1
duty cycle =
t
006aaa812
Fig 4. Duty cycle definition
9. Package outline
3.1 2.7 3 0.6 0.2 1.3 1.0
3.0 1.7 2.5 1.3
1
2 0.50 0.35 0.26 0.10 04-11-11
1.9 Dimensions in mm
Fig 5. Package outline SOT346 (SC-59A/TO-236)
10. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMEG2010AEK
[1]
Package SOT346
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
For further information and the availability of packing methods, see Section 14.
PMEG2010AEK_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 30 March 2007
5 of 9
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
11. Soldering
3.30 1.00 0.70 (3x) 0.60 (3x) 0.70 (3x) 3 3.15 1.55 0.95 1 2 0.95 3.40
1.20 2.60 2.90 solder lands solder paste solder resist occupied area
sot346
Dimensions in mm
Fig 6. Reflow soldering footprint SOT346 (SC-59A/TO-236)
4.70 2.80
solder lands solder resist occupied area
Dimensions in mm
3
5.20 4.60 1.20
1
2
sot346
1.20 (2x) 3.40 preferred transport direction during soldering
Fig 7. Wave soldering footprint SOT346 (SC-59A/TO-236)
PMEG2010AEK_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 30 March 2007
6 of 9
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9. Revision history Release date 20070330 Data sheet status Product data sheet Change notice Supersedes Document ID PMEG2010AEK_1
PMEG2010AEK_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 30 March 2007
7 of 9
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
PMEG2010AEK_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 30 March 2007
8 of 9
NXP Semiconductors
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 5 6 7 8 8 8 8 8 8 9
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 March 2007 Document identifier: PMEG2010AEK_1

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